Visiting Professor - Prof. Ehrenfried Zschech
Visiting Lecture - MATERIALS FOR ADVANCED PACKAGING IN MICROELECTRONICS - MATERIALS SCIENCE AND ENGINEERING, PRODUCT PERFORMANCE AND RELIABILITY
Professor Ehrenfried Zschech, Technical University Dresden & Fraunhofer IKTS Dresden (Germany)
presents a seminar on:
MATERIALS FOR ADVANCED PACKAGING IN MICROELECTRONICS - MATERIALS SCIENCE AND ENGINEERING, PRODUCT PERFORMANCE AND RELIABILITY
25.02.2014, 10:15 a.m. -12:00 p.m., lecture hall 305, Faculty of Materials Science and Engineering WUT / Wołoska St. 141, Warsaw
Lectures co-financed by the European Union in scope of the European Social Fund.
