Visiting Professor - Prof. Ehrenfried Zschech

Visiting Lecture - MATERIALS FOR ADVANCED PACKAGING IN MICROELECTRONICS - MATERIALS SCIENCE AND ENGINEERING, PRODUCT PERFORMANCE AND RELIABILITY 

Professor Ehrenfried Zschech, Technical University Dresden & Fraunhofer IKTS Dresden (Germany)

presents a seminar on:               

MATERIALS FOR ADVANCED PACKAGING IN MICROELECTRONICS - MATERIALS SCIENCE AND ENGINEERING, PRODUCT PERFORMANCE AND RELIABILITY

25.02.2014, 10:15 a.m. -12:00 p.m., lecture hall 305, Faculty of Materials Science and Engineering WUT / WoĊ‚oska St. 141, Warsaw

Lectures co-financed by the European Union in scope of the European Social Fund.

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